The Snapdragon 800 series from Qualcomm has been the no brainer choice for manufacturers in picking their mobile platform for their flagship devices for quite a while. Their latest iteration, the Snapdragon 888, is their contender for 2021 and has been out for quite a while as well. Now, it’s successor might be on the horizon to replace its place for next year’s devices.
Roland Quandt from Winfuture published an article about the successor of the Snapdragon 888. SM8450 will be the part number of the said silicon and will have an internal name of ” Waipi’o “. This aligns to the fact that Qualcomm has been naming their chips on places on Hawaii, with Waipi’o one of them, and the part number of the current Snapdragon 888 is SM8350 and it’s predecessor is SM8250 with the Snapdragon 865.
Aside from the name, Quandt also noted that Qualcomm may have some partnership with Leica. Since it is a system on a chip, if this is correct, Leica and Qualcomm might having some enhancements for the ISP or Image Signal Processor of the processor for enhanced computational photography.
Confluent to his tweets, the Snapdragon X65 modem is allegedly to be built by Samsung at 4nm fabrication process, this was tipped by Digital Chat Station. This might also point out that SM8450 will be built on 4nm of Samsung foundries.
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