New Dimensity Chips Rumored, 10/12nm For The 700 And 800 Series

February 24 14:43 2021 by Ray Kyle De Castro Print This Article

MediaTek has been harvesting success with the popular Dimensity chips and has been used throughout the smartphone competition, atleast in China mostly.

Now, a report from Digitimes that a follow up to the Dimensity 800 and 700 series are in the pipeline.

Oddly enough, the rumored chips to succeed the Dimensity 700 and 800 series will use TSMC’s older 10nm or even 12nm manufacturing process. This is a step down to the current 7nm node which was built in on the Dimensity 700,720,800, 800U and 820.

MediaTek has been fiddling around with the 12nm node quite a lot with the release of the Helio G series which spanned out to be built on 12nm. These were featured on a lot of devices especially from realme’s and Xiaomi’s budget lineup.

The focus of these alleged chips will be 5G connectivity via sub6GHz, multimedia and gaming performance.

It will be interesting if these reports come out true in terms of power efficiency and sustained performance.

So far, it might be an underwhelming bit of information considering that the Dimensity series has delivered exquisite experience with its superior manufacturing process as a catalyst.