Two tipsters from Weibo, popular Chinese social media, has shared some insider information about the upcoming mobile platforms. These include from Qualcomm, MediaTek and Huawei’s HiSilicon.
The Qualcomm Snapdragon model “SM6350” talks made rounds on Weibo for quite a while now. This has first shared by Digital chat station. He claims that the alleged chip will be positioned at the lower end of the market and will power budget 5G devices. He also recently shared that Redmi will be having a device donning the rumored and unannounced chip.
Analyzing the model number, “SM6350” is in line with the Snapdragon 675 with a model number of “SM6150”. This may indicate that the chip is in line or will succeed the Snapdragon 675 bringing 5G capabilities in the 600 series from Qualcomm’s roster.
MediaTek also is reportedly joining the bunch to the budget 5G market. Digital chat station also mentioned “MT6853” chip. That chip does not match any of the existing mobile platforms from the Taiwanese semiconductor giant. The insider claims that the chip is based on the MediaTek Dimensity 800. This does makes sense since the part number for the Dimensity 800 is “MT6873”. The chip, like the Dimensity 800, will have 5G capabilities as well reportedly, albeit with a lesser CPU and GPU performance combo.
Lastly, the HiSilicon Kirin 720 makes the rumor mill as it was mentioned by a reputable source. Not much is known about the chip at this stage as there are no reference or clues, but the source has claimed that it will also be a budget 5G mobile platform.
It will be interesting to see 5G enabled devices on lower asking price. It is not only flagship devices that are future proofing for the eventual 5G connected internet.
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