Different system on a chip or a mobile processor, rumors have been on a ramp up recently. Today, chips from HiSilicon, Qualcomm and MediaTek are to be discussed.

First is a recap of the discussion for the Kirin 820. This is the successor of the Kirin 810. It is rumored to be equipped with Cortex A76 generation of cores and will be paired with a Mali G77 GPU. The chip is expected to be built on a 7nm fabrication process. The debut of the chipset is expected to be in the Honor 30S to be released this 30th of March in China. 

As an addition, it is expected that the Kirin 820 will be positioned on the higher midrange segment from Huawei and Honor devices. It is safe to assume that any higher tier midrange device will be powered by the chip. 

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Another rumor surfaces about Qualcomm’s next system on a chips on their Snapdragon 700 and 600 series. The new 700 series chip bears a part number of SM7350. This is expected to be built on a 7nm fabrication node. It is logical to think that the SM7350 will succeed the Snapdragon 765 series — that has a part number of SM7250. Expectations include an improvement over its predecessor in terms of raw performance and also a boost in 5G performance. 

It is also expected that the chip will keep the 5G modem integrated with all other components of the system on a chip, unlike their Snapdragon 865 in which the modem is separated from the system on a chip. 

The new Snapdragon 600 series is reported to consist of two more additions. The part numbers are SM6250 and SM6350. As for reference, the Snapdragon 675 has a part number of SM6150. Although, not much details have been unveiled about the following. Though, 5G capabilities are not that far fetched from the said processors, especially the latter. 

Finally MediaTek, rumors state that they are developing a brand new chipset that is based on their MediaTek Dimensity 800. The part number is MT6853 which is in line with the MT6873 of the yet to debut Dimensity 800 chip. Not much is known about this, but analyzing the part number, it is logical that this will be a toned down version of the Dimensity 800. 

A recap for the Dimensity 800, the chip consists of Cortex A76 cores with a Mali G57 GPU. The chip is manufactured at 7nm. So a chip having similar, yet toned down, components will be excellent performing. The target market of the chip is expected to be at the lower-end of smartphones.

Sources: HiSilicon , Qualcomm ( 1 , 2 ), MediaTek