by Ray Kyle De Castro | March 19, 2020 9:34 pm
The Kirin 800 series of system on a chips are the positioned on the higher midrange group when it comes to Honor and Huawei devices. This time the Kirin 810, the first system on a chip on the Kirin 800 series moniker, is about to get a refresh.
The Kirin 820 is expected to be built on a 7nm fabrication process. This means that the processor would run as efficient, less power consumption and thermals, as other 7nm built processors.
According to a tipster, the Kirin 820 will also feature the Cortex A76 generation of cores to power the high performance cores. The SoC is paired with a Mali G77 GPU, which is found on the likes of the Dimensity 1000 series or even the Exynos 990. This will ensure uplift of graphics performance compared to the Mali G52 found on the Kirin 810.
Lastly, the SoC is expected to improve on its AI performance. The Kirin 810 is known to have remarkable AI performance because of its DaVinci NPU. The Kirin 820 is expected to continue to trailblaze excellent AI performance at the midrange segment.
Benchmarks of the Kirin 820, compared alongside with popular SoCs such as the Kirin 990,Kirin 980 and the Snapdragon 855. It is noticeable that the Kirin 820 fares well, and even outperforms the Kirin 980 at every test, almost nearing Snapdragon 855 performance at CPU. Although take this with a grain of salt.
The Kirin 820 has yet to debut on a device. Rumors say that it will be powering the upcoming Honor 30S this March 30.
Sources : Weibo, XDADevelopers
Source URL: http://www.thetechnoclast.com/2020/03/19/upcoming-kirin-820-details-surfaces-may-outperform-the-kirin-980/
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